For decades, Moore’s Law was the semiconductor industry’s north star — predictable, reliable, unstoppable. Now, transistors have hit their physical limits, and the entire industry is racing to reinvent itself: new materials, new architectures, advanced packaging, and entirely new device physics. Meanwhile, AI is pushing compute demands to levels fabrication has never had to meet before.
The stakes couldn’t be higher. And plasma is emerging as one of the most powerful tools to navigate what comes next. To break it all down, we’re bringing in one of the most respected voices in semiconductor manufacturing.
Join our next SOSV Deep Tech LIVE on June 2nd (6:00–8:00 PM ET) for a fireside chat with Rick Gottscho, Ph.D., Retired Head of Products & CTO of Lam Research, moderated by Susan Schofer, Partner & Chief Science Officer at SOSV HAX.
- Register In-Person (New York)
- Register Virtual (LinkedIn Live Streaming)
Rick spent 40+ years at the center of semiconductor manufacturing, renowned for his technical leadership in plasma diagnostics and modeling, plasma processing, and process control. He’ll be digging into:
- Where Moore’s Law broke down & what the new playbook looks like
- What advanced compute demands from fabrication today
- Plasma’s expanding role in semiconductor manufacturing
- How innovation gets taken from the lab to scaled production
- Reshoring, supply chain resilience & building a true global ecosystem
If you’re building in semiconductors or physical AI, this talk is worth your evening. For any questions, please contact us at events@sosv.com